{"id":12,"date":"2010-03-18T07:16:48","date_gmt":"2010-03-18T14:16:48","guid":{"rendered":"http:\/\/microbricks.com\/wordpress\/?page_id=12"},"modified":"2010-07-26T13:17:31","modified_gmt":"2010-07-26T20:17:31","slug":"services","status":"publish","type":"page","link":"https:\/\/www.microbricks.com\/?page_id=12","title":{"rendered":"Services"},"content":{"rendered":"<p>We provide expert R&amp;D and Management Consulting services in the following technical areas.\u00a0 Our team of experts posses over 30 years of combined experience conducting research, inventing products and deploying solutions in the microelectronics and microsystems technology space.<\/p>\n<ul>\n<li><em><strong>Microsystems<\/strong><\/em><\/li>\n<\/ul>\n<p style=\"padding-left: 60px;\">Design and Simulation<\/p>\n<p style=\"padding-left: 60px;\">Package Development<\/p>\n<p style=\"padding-left: 60px;\">Testing and Characterization<\/p>\n<p style=\"padding-left: 60px;\">Assembly Technologies<\/p>\n<p style=\"padding-left: 60px;\">Failure Analysis<\/p>\n<p style=\"padding-left: 60px;\">Product Integration<\/p>\n<ul>\n<li><em><strong>Microelectronics<\/strong><\/em><\/li>\n<\/ul>\n<p style=\"padding-left: 60px;\">Design and Simulation<\/p>\n<p style=\"padding-left: 60px;\">Package Development<\/p>\n<p style=\"padding-left: 60px;\">Testing and Characterization<\/p>\n<p style=\"padding-left: 60px;\">Failure Analysis<\/p>\n<p style=\"padding-left: 60px;\">Radiation Effects Testing and Simulation<\/p>\n<ul>\n<li><strong><em>Intellectual Property Portfolios <\/em><\/strong><\/li>\n<\/ul>\n<p style=\"padding-left: 60px;\">Prosecution<\/p>\n<p style=\"padding-left: 60px;\">Litigation<\/p>\n<p style=\"padding-left: 60px;\">Valuation<\/p>\n<p style=\"padding-left: 60px;\">Management<\/p>\n","protected":false},"excerpt":{"rendered":"<p>We provide expert R&amp;D and Management Consulting services in the following technical areas.\u00a0 Our team of experts posses over 30 years of combined experience conducting research, inventing products and deploying solutions in the microelectronics and microsystems technology space.<\/p>\n<p><em><strong>Microsystems<\/strong><\/em><\/p>\n<p style=\"padding-left: 60px;\">Design and Simulation<\/p>\n<p style=\"padding-left: 60px;\">Package Development<\/p>\n<p style=\"padding-left: 60px;\">Testing and Characterization<\/p>\n<p style=\"padding-left: 60px;\">Assembly Technologies<\/p>\n<p style=\"padding-left: 60px;\">Failure Analysis<\/p>\n<p [...] \n\n","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":4,"comment_status":"closed","ping_status":"open","template":"","meta":{"footnotes":""},"class_list":["post-12","page","type-page","status-publish","hentry"],"_links":{"self":[{"href":"https:\/\/www.microbricks.com\/index.php?rest_route=\/wp\/v2\/pages\/12","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.microbricks.com\/index.php?rest_route=\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.microbricks.com\/index.php?rest_route=\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.microbricks.com\/index.php?rest_route=\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.microbricks.com\/index.php?rest_route=%2Fwp%2Fv2%2Fcomments&post=12"}],"version-history":[{"count":4,"href":"https:\/\/www.microbricks.com\/index.php?rest_route=\/wp\/v2\/pages\/12\/revisions"}],"predecessor-version":[{"id":1066,"href":"https:\/\/www.microbricks.com\/index.php?rest_route=\/wp\/v2\/pages\/12\/revisions\/1066"}],"wp:attachment":[{"href":"https:\/\/www.microbricks.com\/index.php?rest_route=%2Fwp%2Fv2%2Fmedia&parent=12"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}