{"id":295,"date":"2010-04-04T07:46:30","date_gmt":"2010-04-04T14:46:30","guid":{"rendered":"http:\/\/microbricks.com\/wordpress\/?page_id=295"},"modified":"2025-11-20T10:11:16","modified_gmt":"2025-11-20T17:11:16","slug":"3d-integration","status":"publish","type":"page","link":"https:\/\/www.microbricks.com\/?page_id=295","title":{"rendered":"3D Integration"},"content":{"rendered":"\n<p><a href=\"https:\/\/news.google.com\/search?q=3D%20Integration&amp;hl=en-US&amp;gl=US&amp;ceid=US%3Aen\">https:\/\/news.google.com\/search?q=3D%20Integration&amp;hl=en-US&amp;gl=US&amp;ceid=US%3Aen<\/a><\/p>\n\n\n\n<div class=\"wp-block-columns is-layout-flex wp-container-core-columns-is-layout-9d6595d7 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\" style=\"flex-basis:100%\"><ul class=\"wp-block-rss\"><li class='wp-block-rss__item'><div class='wp-block-rss__item-title'><a href='https:\/\/news.google.com\/rss\/articles\/CBMikgFBVV95cUxOSHoycUV3SDIzUGJwQk5RSm9YLVg2R2Jkd09wQjREQzU3bHRDWFF2cE9KcWcxREpzVk8ybkJxNjZsQkhwUllNak94aDJpbDNSYm5Nai0yYWdBNGhkVVJ3ekRDMnNIdUk4ZDBHd2Jrdk9sWVNPd2pOQUpFdGVFeWZkc3pBRWd1TExNWHp1bXpmOVF0dw?oc=5'>Applied Materials Unveils New Systems for AI Chip 3D Architectures &#8211; TimesTech<\/a><\/div><\/li><li class='wp-block-rss__item'><div class='wp-block-rss__item-title'><a href='https:\/\/news.google.com\/rss\/articles\/CBMieEFVX3lxTE14R3JmOUF1Ny0xM3R1NUljODVZNUN0OVczUkJ1TnJiQzFtS2o2Mkx0R3NQUjhZaU1KenJaS01QMnhHd2dJODR4eEJVcFk0eUdyOUJFRkg1UFY5Qm52WW1oRWVWUDFYTTVOQWFTSS1OV1RfcEhnd09hOA?oc=5'>Records Fall for 3D Chip Tech &#8211; AOL.com<\/a><\/div><\/li><li class='wp-block-rss__item'><div class='wp-block-rss__item-title'><a href='https:\/\/news.google.com\/rss\/articles\/CBMib0FVX3lxTFBvcFZ5MkQxOXZPS0FzbkYtZlVNZGdZOHVtUXBGUlFubWVEN25hXzNUcFRObUpvQWZEYjNYNDVUbldXSWZGWFpKWVY0c1hHZkVIQUxMSV80eW1VUHI3X1dIak4tWV9xMHVDWVdEdndoMA?oc=5'>IBM proposes NanoStack architecture for ultra-dense 3D chips &#8211; Crypto Briefing<\/a><\/div><\/li><li class='wp-block-rss__item'><div class='wp-block-rss__item-title'><a href='https:\/\/news.google.com\/rss\/articles\/CBMic0FVX3lxTFB2VHVoWU9tNEVjTjJQRzZwRkMxVzh3enhUUmlVT2dOVTRhNjBUck1fQnpET2pNQUk2NGJLZGk0aTNqazlxM2FjNUp2bFh2VGVtM09DeVN3YlFTVVQtN2ZIUHQ5RkR4U01OOXNVcHdfdzBmaTA?oc=5'>Realizing The Future Of 3D-IC Design &#8211; 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[&#8230;]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":293,"menu_order":1,"comment_status":"closed","ping_status":"open","template":"","meta":{"footnotes":""},"class_list":["post-295","page","type-page","status-publish","hentry"],"_links":{"self":[{"href":"https:\/\/www.microbricks.com\/index.php?rest_route=\/wp\/v2\/pages\/295","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.microbricks.com\/index.php?rest_route=\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.microbricks.com\/index.php?rest_route=\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.microbricks.com\/index.php?rest_route=\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.microbricks.com\/index.php?rest_route=%2Fwp%2Fv2%2Fcomments&post=295"}],"version-history":[{"count":11,"href":"https:\/\/www.microbricks.com\/index.php?rest_route=\/wp\/v2\/pages\/295\/revisions"}],"predecessor-version":[{"id":1517,"href":"https:\/\/www.microbricks.com\/index.php?rest_route=\/wp\/v2\/pages\/295\/revisions\/1517"}],"up":[{"embeddable":true,"href":"https:\/\/www.microbricks.com\/index.php?rest_route=\/wp\/v2\/pages\/293"}],"wp:attachment":[{"href":"https:\/\/www.microbricks.com\/index.php?rest_route=%2Fwp%2Fv2%2Fmedia&parent=295"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}